Epoxy Molding compound materials

 

PCM offer very sophisticated EMC(Epoxy molding compound) resins with very narrow softening point range widely used in electronics casting/molding and encapsulation.

 

ITEM

EEW

Softening point

Color

(Gardner)

Comments

CNE-7000L

190-210

61-67

3

Adhesives, Laminates, Encapsulation, Casting, Powder Coatings

CNE-7000ML

190-210

67-73

3

Adhesives, Laminates, Encapsulation, Casting, Powder Coatings

CNE-7000M

190-210

72-76

3

Adhesives, Laminates, Encapsulation, Casting, Powder Coatings

CNE-7000H

190-210

76-82

3

Adhesives, Laminates, Encapsulation, Casting, Powder Coatings